Precision Titanium Machining for AI Infrastructure & Optical Communications
High-precision custom titanium component manufacturing engineered to eliminate thermal drift, prevent liquid cooling leakage, and deliver absolute EMI shielding for high-density compute nodes and 800G/1.6T optical transceivers.
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精密CNCフライス加工 — 薄肉EMIシールドを備えた800G/1.6T光トランシーバハウジング
800Gおよび1.6T光トランシーバ向け高精密チタン光電子エンクロージャ。薄肉ポケット加工（0.4mm壁厚）と電磁干渉（EMI）シールドにより、レーザー溶接対応パッケージ内のデバイス動作を保護します。
800G/1.6Tトランシーバハウジングフライス加工
精密CNC · 薄肉0.4mm · EMIシールド800Gおよび1.6Tで動作する光トランシーバには、薄肉ポケットと一体型EMIシールド構造を備えたハウジングが必要です。チタンは導電性のある筐体として機能し、チタンの自然酸化層による耐食性を維持しながら、追加のシールド材なしでEMIを抑制します。
技術実装- 壁厚0.4mmまでの薄肉ポケット加工 — 導電性コーティング不要で自然なEMIシールドを実現
- 低CTE（8.6 ppm/°C）により、0-70°Cの動作範囲で光学的位置ずれを排除
- クロストーク分離壁を一体加工 — 隣接チャンネル間の信号干渉を排除
ファイバアライメントと気密封止
±0.005mm位置決め · レーザー溶接対応ファイバフィードスルー位置決めとシール面の共平面性が、トランシーバアセンブリ内の光結合効率を直接決定します。チタンの寸法安定性と加工性により、厳しい位置公差が可能となり、レーザー溶接気密封止との互換性を確保します。
技術実装- シール面共平面性 ≤ 0.01mm — 業界規格あたりのレーザー溶接気密封止を実現
- ファイバフィードスルー穴位置決め ±0.005mm — コア間の光結合を保証
- グレード2およびグレード5チタンオプション — 特定の光学部品のCTE要件に適合
Multi-Axis CNC Machining — Liquid Cooling Manifolds, Cold Plates & Quick-Disconnect Valves
High-precision titanium liquid cooling manifolds and cold plates for AI GPU/ASIC clusters. Corrosion-free fluid channels machined from Grade 5 Titanium — engineered for leak-proof operation under relentless thermal cycling.
Liquid Cooling Manifolds & Cold Plates
Multi-Axis CNC · Grade 5 Ti · GPU/ASIC ClustersAI training clusters generate heat densities exceeding 1000 W per GPU demanding direct-to-chip liquid cooling with absolute reliability. Our multi-axis CNC machining produces titanium manifolds and cold plates with optimized micro-channel geometries.
Technical Implementation- Micro-channel geometry optimized for maximum heat transfer at coolant pressures up to 10 bar
- Titanium's natural corrosion resistance eliminates galvanic reactions with dielectric coolants
- Single-piece manifold construction eliminates potential leak paths from multi-part welded assemblies
Quick-Disconnect Valve & Fitting Manufacturing
Ra ≤ 0.4 µm Sealing · Helium Leak TestedData center liquid cooling loops require quick-disconnect valves and fittings that maintain zero-leak performance across thousands of mate-demate cycles. Our precision-turned titanium valve bodies achieve Ra ≤ 0.4 µm sealing surface finishes.
Technical Implementation- Sealing surface finish Ra ≤ 0.4 µm — ensures leak-proof O-ring sealing across temperature range
- Thread forms per ASME B1.1 — consistent preload for thousands of connect-disconnect cycles
- 100% helium leak testing available — verified to < 1×10⁻⁹ mbar·L/s for critical cooling loops
CMM Dimensional Validation — GD&T Coplanarity & Geometric Alignment for Optical Sub-Assemblies
Absolute dimensional verification via CMM mapping to ASME Y14.5 GD&T standards guaranteeing coplanarity, flatness, and positional accuracy for high-yield fiber alignment in optical transceiver sub-assemblies.
CMM for Optical Component Verification
ZEISS CMM · ±1.9 µm · ASME Y14.5 GD&TOptical transceiver housings and liquid cooling manifolds demand micron-level geometric precision. Our ZEISS CMM platforms measure flatness, parallelism, true position, and profile tolerances across all sealing surfaces.
Technical Implementation- ZEISS CMM ±1.9 µm volumetric accuracy — ISO 17025 traceable calibration for optical components
- Sealing surface coplanarity ≤ 0.01 mm — ensures consistent laser weld hermeticity
- Full GD&T reporting per ASME Y14.5 — flatness, parallelism, profile, true position on every lot
GD&T for High-Yield Assembly
True Position ±0.01mm · Flatness ≤0.005mm/25mmSub-micron geometric tolerances on optical transceiver housings directly determine optical coupling efficiency and manufacturing yield. Our GD&T verification culture ensures every component meets ASME Y14.5 specifications.
Technical Implementation- True position ≤ ±0.01 mm for fiber array and laser diode mounting features
- Surface flatness ≤ 0.005 mm per 25 mm — ensures PCB and sub-mount seating without stress
- SPC trending for production monitoring — early detection of tool wear or thermal drift
100% Material Traceability — EN 10204 3.1 MTR & Heat Number Tracking for Mission-Critical Infrastructure
Every AI infrastructure component is backed by EN 10204 3.1 Mill Test Reports and laser-marked heat numbers validating metallurgical purity to prevent invisible micro-cracks in 24/7 data center server matrices.
EN 10204 3.1 MTR & Heat Number
Every batch of Grade 2, Grade 5, and specialty titanium is certified with EN 10204 Type 3.1 documentation verifying chemical composition and mechanical properties.
- Chemical composition per ASTM B265/B348 — verified for purity and interstitial element control
- Laser-marked heat number on each component — permanent traceability to mill certification
- Digital MTR archive — full traceability chain from raw material to finished component
Reliability for 24/7 Uptime
Data center cooling and optical infrastructure operates 24/7/365 — component failure is not an option. Our strict material verification and processing controls eliminate the risk of invisible micro-cracks or metallurgical defects.
- 100% material verification before machining — eliminates hidden defects in critical cooling paths
- Dye penetrant inspection available — verifies surface integrity on pressure-containing components
- Full traceability chain — raw material heat lot to machining to cleaning to delivery
認定済み
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One Metal. One Focus. Infinite Precision.
Founded in 2011 in Baoji's Titanium Valley, BOZE Metal is dedicated exclusively to titanium — from raw material to precision engineering. AS9100D, ISO 13485 & ISO 9001 certified with 500+ clients across Aerospace, Medical & Motorsport industries, we deliver end-to-end precision titanium CNC machining with full material traceability from source to component.
Boze Titanium Manufacturing Center is operated by Baoji Boze Metal Products Co., Ltd.
Certifications verified by NADCAP and compliant with ASTM International titanium standards (B265, B348, B381, F136, F2924) and ISO 13485 medical-device QMS.