Semiconductor
💡 Plasma Chamber Liners, Shields & Thermal Hardware
Rough-bead-blasted chamber wall liners, exhaust plenum baffle plates, ceramic heater clamping plates, slit-valve protection shunts, shield stand-off bushings, threaded blind studs, arc-shaped shadow ring brackets, RF grounding spring fingers, thermocouple shielding caplets
What is Plasma Chamber Liners, Shields & Thermal Hardware?
💡 Plasma Chamber Liners, Shields & Thermal Hardware represents a complete system of precision titanium components engineered for Semiconductor applications. Rough-bead-blasted chamber wall liners, exhaust plenum baffle plates, ceramic heater clamping plates, slit-valve protection shunts, shield stand-off bushings, threaded blind studs, arc-shaped shadow ring brackets, RF grounding spring fingers, thermocouple shielding caplets The system integrates 8 distinct component types manufactured through 3 specialized processes.
Key manufacturing processes for this system include Cleanroom CNC Class 100 for chamber shield geometry, Electropolish Ra <0.25um at 200W fiber laser, UHP DI water cascade rinse at 200W fiber laser, Particle count MIL-STD-1246 at 200W fiber laser, Electropolish Ra <0.25um with 0.5mm corner radius, each selected and qualified to meet component-specific requirements.
Engineering & Design Principles
Material: Grade 2 (CP-Ti) for plasma liners, baffles, and shields — excellent plasma erosion resistance and film adherence with bead-blasted surface. Grade 5 for clamping plates, shadow ring brackets, and studs
Form: Plate/sheet for liners, baffles, and shields via waterjet/laser cutting + forming. Bar for stand-offs and studs. Wire forming for spring fingers. Bead blasting of plasma-facing surfaces for film adhes
Standards & Material Specifications
Standards: ASTM B265 Grade 2 (liners) / ASTM B348 Grade 5 (hardware), bead-blasted plasma face, Class 100 cleaned
Engineering Solution Blueprint
Semiconductor Process Chamber Components
Semiconductor
1 Part Feature Analysis
Large diameter rings, liner shields, focus rings, clamp rings, gas distribution plates — thin-wall, high-purity
- ⚠️ Plasma erosion
- ⚠️ Particle generation
- ⚠️ Metal contamination of wafers
- ⚠️ Thermal uniformity
- ⚠️ Cost of frequent replacement
2 Material Selection Rationale
Grade 2 CP-Ti — Industrial pure Ti, general corrosion resistance
Grade 2 (CP-Ti) is preferred for chamber components due to its low sputter yield and minimal particle generation in plasma environments. Grade 5 for structural rings.
3 Form Selection Rationale
Plate / Sheet — for welding, machined housings
Plate stock for large diameter rings and shields. Tube for gas distribution lines. Bar for fasteners.
4 Manufacturing Process & Services
Core Processes:
Toll Processing Services:
Process Pitfalls:
- ⚠️ Gas distribution hole diameter tolerance +-0.01mm required for uniform plasma
- ⚠️ All surfaces must be electropolished to Ra<0.4um to minimize particle generation
5 Procurement Specifications
ASTM B265 Grade 2, double-melted (VAR), electropolished, Class 10 cleanroom packaged, particle count certified
Manufacturing Process Flow
Titanium anodizing (AMS 2488) grows a controlled oxide layer through electrochemical conversion in an electrolyte bath. Type II produces interference
5-axis CNC milling centers provide simultaneous multi-axis interpolation for complex titanium components. The ability to tilt the tool relative to the
Fiber laser cutting of titanium uses a focused 1 µm wavelength beam to melt and expel material through a coaxial assist gas jet. The narrow (0.1–0.3 m
Components in This System
| Component | Material |
|---|---|
| Titanium Ceramic Heater Clamp Plate | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Chamber Liner (Upper) | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Exhaust Baffle Plate | Grade 2 CP-Ti (Bead Blasted) |
| Titanium RF Grounding Spring Finger | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Shadow Ring Bracket | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Shield Stand-off Bushing | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Slit-Valve Protection Shunt | Grade 2 CP-Ti (Bead Blasted) |
| Titanium Threaded Blind Stud (Interior) | Grade 2 CP-Ti (Bead Blasted) |
Frequently Asked Questions
What titanium grades are used in Plasma Chamber Liners, Shields & Thermal Hardware systems?
What manufacturing processes are used for Plasma Chamber Liners, Shields & Thermal Hardware?
What quality standards apply to Plasma Chamber Liners, Shields & Thermal Hardware components?
What industries use Plasma Chamber Liners, Shields & Thermal Hardware?
Can you provide DFM feedback for Plasma Chamber Liners, Shields & Thermal Hardware designs?
Engineering Trends
- ▸ Process: Waterjet/laser cutting of liner profiles
- ▸ Process: Bead blasting of plasma-facing surfaces
- ▸ Process: CNC machining of clamping plates and brackets
Related Manufacturing Capabilities
These specialized processes support Plasma Chamber Liners, Shields & Thermal Hardware component manufacturing.
One Metal. One Focus. Infinite Precision.
Founded in 2011 in Baoji's Titanium Valley, BOZE Metal is dedicated exclusively to titanium — from raw material to precision engineering. AS9100D, ISO 13485 & ISO 9001 certified with 500+ clients across Aerospace, Medical & Motorsport industries, we deliver end-to-end precision titanium CNC machining with full material traceability from source to component.
Boze Titanium Manufacturing Center is operated by Baoji Boze Metal Products Co., Ltd.
Certifications verified by NADCAP and compliant with ASTM International titanium standards (B265, B348, B381, F136, F2924) and ISO 13485 medical-device QMS.