Titanium RF Grounding Spring Finger is an ultra-clean rf grounding spring component designed for RF grounding spring contact finger (Nitinol). Manufactured from Grade 2 CP-Ti with Class 100 cleanroom protocols, it provides the non-magnetic, low-outgassing, and particle-free performance essential for wafer fabrication environments.
Titanium RF Grounding Spring Finger
| Technical Parameter | Specification |
|---|---|
| Component SKU | TI-SEM-CHA-GROUND |
| Standards & Specifications | MIL-STD-810HASTM B117 |
| Surface Finish | PVD TiAlN coating (2-3um, HV2500) |
Titanium RF Grounding Spring Finger
RF grounding spring contact finger (Nitinol)
| Technical Parameter | Specification Value |
|---|---|
| International Compliance | MIL-STD-810H, ASTM B117 |
| Surface Finish & Max Temp | PVD TiAlN coating (2-3um, HV2500) |
| NDT & Quality Control | Helium Mass Spectrometry Leak Detection per ASTM E493 (<1e-9 mbar·L/s); Particle Count Verification per SEMI E98 (Class 100); Surface Profilometry per ISO 4287 (Ra verification); Positive Material Identification (PMI) via XRF per ASTM E1476; Dimensional verification via CMM per ISO 10360 |
- • 100% Traceability: Mill Test Certificate (EN 10204 3.1) with heat analysis & mechanical testing.
- • NDT Verification: Helium Mass Spectrometry Leak Detection per ASTM E493 (<1e-9 mbar·L/s); Particle Count Verification per SEMI E98 (Class 100); Surface Profilometry per ISO 4287 (Ra verification); Positive Material Identification (PMI) via XRF per ASTM E1476; Dimensional verification via CMM per ISO 10360.
- • Compliance: REACH, RoHS 3 certified. FAI AS9102 available.
- • Process: 5-axis CNC contouring, electropolishing, ultrasonic clean, vision inspection.
- • Thermal Stress Relief: Post-machining vacuum annealing (540-675°C under Argon) reduces distortion risk >70%.
- • Rolled Threads: Thread rolling (not cutting) increases fatigue limits by 30-50%.
Q: What metallic contamination levels are guaranteed for Titanium RF Grounding Spring Finger? ▼
Titanium RF Grounding Spring Finger is manufactured to ensure metallic surface contamination below 1×10¹⁰ atoms/cm² for Fe, Cr, Ni, Cu, and Zn per SEMI F108. For rf grounding spring in front-end processes, additional ICP-MS verification is available with detection limits to 1×10⁸ atoms/cm². Double VAR-melted starting stock ensures inclusion-free microstructure.
Q: What is the typical lead time for Titanium RF Grounding Spring Finger orders? ▼
Standard lead time for Titanium RF Grounding Spring Finger is 15-25 business days depending on quantity and complexity. Rush orders (3-5 working days) are available for prototype evaluation. Sample evaluation (1-5 units) can be expedited to 5-7 business days. Volume pricing is available for production quantities above 100 units.
Q: What material certifications are provided with Titanium RF Grounding Spring Finger? ▼
Each Titanium RF Grounding Spring Finger shipment includes EN 10204 Type 3.1 mill test certificate with chemical analysis, mechanical properties, and heat identification. Dimensional inspection reports and Certificate of Conformance (CoC) are standard. First Article Inspection Reports (FAIR) per AS9102 are available on request for rf grounding spring.
§ Grade 2 CP-Ti Selection for rf grounding spring
Function
A precision Chamber Shield component designed for . The selection of Grade 2 CP-Ti (Bead Blasted) provides the optimal balance of strength-to-weight and environmental resistance required for this Semiconductor application.
Specifications
- SKU: TI-SEM-CHA-GROUND
- Category: Chamber Shield
- Industry: Semiconductor
- Material: Grade 2 CP-Ti (Bead Blasted)
- Process: 5-axis CNC contouring, electropolishing, ultrasonic clean, vision inspection
- Weight: Weight optimized through topology analysis - 30% lighter than baseline
§ UHV Particle & Surface Contamination Verification
Quality Management
Manufactured to aerospace-grade quality standards with 100% material traceability. FAIR documentation available per AS9102 for Titanium RF Grounding Spring Finger production lots.
Inspection & NDT
Coordinate measuring machine (CMM) full geometry verification; dye penetrant inspection (DPI) per ASTM E1417; spectroscopic alloy verification per ASTM E1476
§ Cleanroom Manufacturing & Finishing Process
Titanium RF Grounding Spring Finger is manufactured using 5-axis cnc contouring, electropolishing, ultrasonic clean, vision inspection. Each operation is performed by certified machinists with real-time process monitoring and dimensional verification at critical stages. Heat code traceability is maintained throughout all production steps.
Commercial Logistics & Procurement Framework
Pricing and lead times for Titanium RF Grounding Spring Finger are batch-dependent. Contact our supply chain team for volume-based tiered pricing.
Regulatory & Quality Assurance Ledger
Verifiable certifications for Titanium RF Grounding Spring Finger
Material Test Certificate (MTC)
EN 10204 3.1
Environmental Compliance
REACH (EC No 1907/2006)
Restricted Substances
RoHS 3 Directive (2015/863/EU)
Dimensional Tolerances
ISO 2768-m
Standard: MIL-STD-810H
MIL-STD-810H
Standard: ASTM B117
ASTM B117
Systems Interconnectivity & Topology
Cross-functional integration matrix for Tier-1 supply chains and assembly orchestration.
- ▸ Platform Interface Plate
- ▸ System Integration Frame
Titanium RF Grounding Spring Finger
Material: Grade 2 CP-Ti (Bead Blasted)
SKU: TI-SEM-CHA-GROUND
Industry: Semiconductor / System: Plasma Chamber Liners, Shields & Thermal Hardware
- ▸ Retention Clip Assembly
- ▸ Compression Spring Set
- ▸ Installation Tool
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Founded in 2011 in Baoji's Titanium Valley, BOZE Metal is dedicated exclusively to titanium — from raw material to precision engineering. AS9100D, ISO 13485 & ISO 9001 certified with 500+ clients across Aerospace, Medical & Motorsport industries, we deliver end-to-end precision titanium CNC machining with full material traceability from source to component.
Boze CNC Ti is the dedicated titanium manufacturing center of Baoji Boze Metal Products Co., Ltd.