Semiconductor
💻 Semiconductor Process Chamber Components
Large diameter rings, liner shields, focus rings, clamp rings, gas distribution plates — thin-wall, high-purity
What is Semiconductor Process Chamber Components?
💻 Semiconductor Process Chamber Components represents a complete system of precision titanium components engineered for Semiconductor applications. Large diameter rings, liner shields, focus rings, clamp rings, gas distribution plates — thin-wall, high-purity The system integrates 3 distinct component types manufactured through 3 specialized processes.
Key manufacturing processes for this system include Cleanroom CNC Class 100 for ion implant geometry, Electropolish Ra <0.25um with SPC sampling, UHP DI water cascade rinse with SPC sampling, Particle count MIL-STD-1246 with SPC sampling, Cleanroom CNC Class 100 for lithography geometry, each selected and qualified to meet component-specific requirements.
Engineering & Design Principles
Material: Grade 2 (CP-Ti) is preferred for chamber components due to its low sputter yield and minimal particle generation in plasma environments. Grade 5 for structural rings.
Form: Plate stock for large diameter rings and shields. Tube for gas distribution lines. Bar for fasteners.
Standards & Material Specifications
Standards: ASTM B265 Grade 2, double-melted (VAR), electropolished, Class 10 cleanroom packaged, particle count certified
Engineering Solution Blueprint
Semiconductor Process Chamber Components
Semiconductor
1 Part Feature Analysis
Large diameter rings, liner shields, focus rings, clamp rings, gas distribution plates — thin-wall, high-purity
- ⚠️ Plasma erosion
- ⚠️ Particle generation
- ⚠️ Metal contamination of wafers
- ⚠️ Thermal uniformity
- ⚠️ Cost of frequent replacement
2 Material Selection Rationale
Grade 2 CP-Ti — Industrial pure Ti, general corrosion resistance
Grade 2 (CP-Ti) is preferred for chamber components due to its low sputter yield and minimal particle generation in plasma environments. Grade 5 for structural rings.
3 Form Selection Rationale
Plate / Sheet — for welding, machined housings
Plate stock for large diameter rings and shields. Tube for gas distribution lines. Bar for fasteners.
4 Manufacturing Process & Services
Core Processes:
Toll Processing Services:
Process Pitfalls:
- ⚠️ Gas distribution hole diameter tolerance +-0.01mm required for uniform plasma
- ⚠️ All surfaces must be electropolished to Ra<0.4um to minimize particle generation
5 Procurement Specifications
ASTM B265 Grade 2, double-melted (VAR), electropolished, Class 10 cleanroom packaged, particle count certified
Manufacturing Process Flow
CNC turning of titanium on multi-axis lathes produces cylindrical components with precision diameters and surface finishes. Live tooling enables milli
Laser drilling of titanium uses pulsed laser energy to create precise holes through percussion or trepanning methods. Hole diameters range from 0.05 m
Titanium anodizing (AMS 2488) grows a controlled oxide layer through electrochemical conversion in an electrolyte bath. Type II produces interference
Components in This System
| Component | Material |
|---|---|
| Titanium Ion Implantation Electrode | Grade 5 Ti-6Al-4V |
| Titanium Lithography Stage Flexure | Grade 5 Ti-6Al-4V |
| Titanium Wafer Handling End-Effector | Grade 5 Ti-6Al-4V |
Frequently Asked Questions
What titanium grades are used in Semiconductor Process Chamber Components systems?
What manufacturing processes are used for Semiconductor Process Chamber Components?
What quality standards apply to Semiconductor Process Chamber Components components?
What industries use Semiconductor Process Chamber Components?
Can you provide DFM feedback for Semiconductor Process Chamber Components designs?
Engineering Trends
- ▸ Process: CNC turning/boring of rings
- ▸ Process: Precision drilling of gas holes
- ▸ Process: Surface treatment (anodizing)
Related Manufacturing Capabilities
These specialized processes support Semiconductor Process Chamber Components component manufacturing.
One Metal. One Focus. Infinite Precision.
Founded in 2011 in Baoji's Titanium Valley, BOZE Metal is dedicated exclusively to titanium — from raw material to precision engineering. AS9100D, ISO 13485 & ISO 9001 certified with 500+ clients across Aerospace, Medical & Motorsport industries, we deliver end-to-end precision titanium CNC machining with full material traceability from source to component.
Boze CNC Ti is the dedicated titanium manufacturing center of Baoji Boze Metal Products Co., Ltd.